Our international client is currently searching for a Staff Package Design Engineer to join the dynamic team in Edinburgh. The role will involve working closely with internal and external customers to develop cutting-edge packaging solutions for high-performance products including amplifiers, codecs, and DSPs. Utilizing AutoCAD, Cadence SiP tools will be required for electrical simulation and manufacturing validation solutions for package designs. Working with cross functional teams will be an important part of the role.

Required skills for the Staff Package Design Engineer will include: Strong semiconductor package design experience Experienced Cadence SiP layout user Understanding of electrical simulation results on a package design Strong written and verbal communication skills; able to review technical ideas with customers and high-level management BSc or above in Mechanical, Electrical, Chemical, or Materials Engineering

Please contact Rachel Anderson for further details. ...